Call for papers : Click here


Submission :


For any question, please contact :


Final paper submission

Authors are kindly requested to submit the final version of the their paper in English and with a limitation of 7 pages, including paper title, authors and affiliations, figures and references (maximum size 2MB). Authors must modify their paper according to the reviewer's remarks.


To prepare the manuscripts, authors should use the template available in the SDEMPED Website, according to the IEEE two-column format.  Click here to download the template Only  submissions  in  electronic  form  will  be  accepted.


If required, a visa support letter can be provided for registered international authors and attendees who have paid in full. Authors will receive their visa letter once their registration is confirmed. Please contact our secretariat sdemped2019 @ for further details.


Accepted and presented papers will be published in IEEE Xplore® and the authors are encouraged to submit enhanced and journal quality papers to the Transactions of the IEEE sponsoring Societies.


The best presented papers (up to 3) will receive the SDEMPED Best Paper Award during the conference.


Special Sessions for IEEE-SDEMPED’2019

“Stability and Reliability of Power Semiconductor Devices”
Organizers: Dr Marina Antoniou and Dr. Neophytos Lophitis           


“Electrical Machines Fault Diagnosis During Transient Operation”
Organisers: Prof. Jose A. Antonino-Daviu and Dr Konstantinos N. Gyftakis      


“Resilience of hydrogen-energy systems”
Organisers: Prof. Daniel Hissel and Prof. Marie-Cécile Pera                       


“Artificial intelligence based fault detection and identification procedures applied to electromechanical systems”
Organisers: Dr Roque A. Osornio Rios, Dr Antoine Picot and Dr Miguel Delgado Prieto        



SDEMPED secretariat

6 allée Emile Monso - BP 34038

31029 Toulouse Cedex 4


05 34 32 31 19